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Transport properties of plasma-deposited amorphous silicon dioxide

TitoloTransport properties of plasma-deposited amorphous silicon dioxide
Tipo di pubblicazioneArticolo su Rivista peer-reviewed
Anno di Pubblicazione1989
AutoriMariucci, L., Fortunato G., Foglietti P., Reita C., and Della Sala Dario
RivistaJournal of Non-Crystalline Solids
Volume115
Paginazione123-125
ISSN00223093
Parole chiaveAmorphous Silicon Dioxide Thin Films, Plasma-Enhanced Chemical Vapor Deposition, Semiconducting Films–Chemical Vapor Deposition, Semiconducting Silicon Compounds
Abstract

Electronic quality a-SiO2 have been deposited by PECVD showing high breakdown fields and low trapping probability down to thickness of 16 nm. The transport properties of this material have been analyzed. The Fowler-Nordheim mechanism has been ruled out due a marked temperature sensitivity of the current around room temperature. On the other hand thermally activated transport, such as Schottky or Frenkel-Poole mechanisms, fit reasonably well the experimental data. However a better fit of the overall data seems to support the Schottky as the main transport mechanism in our materials. © 1989.

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cited By 3

URLhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-0024780127&doi=10.1016%2f0022-3093%2889%2990381-5&partnerID=40&md5=2c8feb45ddde0a78890de05dbef38661
DOI10.1016/0022-3093(89)90381-5
Citation KeyMariucci1989123